About our group: Our HDD backend test equipment team develops and sustains the firmware, control software, automation, and vision systems that support reliable high-volume manufacturing test operations. In this role, you will help deliver robust test platforms that improve
About Real-Time Team We are building a new team here in Bangkok. This is a long term multi-year plan to form a strong team to provide system-level expertise in developing low-latency, high-throughput as well as high
If you desire to be part of something special, to be part of a winning team, to be part of a fun team – winning is fun. We are looking forward to a Project Manager in
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS
Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time.
Role Scope and Impact Works across functions to identify, shape, and deliver process improvement and transformation opportunities. Provides expertise in TMW, Lean, structured problem solving, process standardization, and end-to-end optimization. Partners with operational, customer, finance, supply
Change the world. Love your job. The Field Applications Engineer - MCU is responsible for partnering with Sales and providing MCU related technical expertise throughout the sales cycle. The FAE proactively identifies current products and/or creative
Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS