Ready Computing Jobs In Thailand - 3 Job Positions Available

Job Description Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS

The candidate required to work at Tokyo, Japan. Client Overview Our client is a leading global IT services and digital transformation enterprise operating at the forefront of enterprise computing, cloud-native infrastructure, artificial intelligence, and advanced software engineering.